FAQ

Please refer to the professional selection table above, prioritizing the maximum curing temperature and required cell size for your resin system.

The Rifeng W series features a medium cell size that achieves an optimal compromise between weight and bonding strength[cite: 45, 48]. It offers approximately 35% lower resin absorption compared to coarse-cell grades, which is critical for maximizing the flight endurance of UAVs while maintaining structural stiffness[cite: 48, 50].

Rifeng F is specifically designed for antennas and radomes due to its fine cell structure[cite: 82, 83]. This ultra-fine cell size ensures minimal resin penetration into the core surface, maintaining the low dielectric constant and high transmission properties required for high-frequency telecommunications[cite: 83, 86].

Unlike traditional block foams, Rifeng E-Li is an in-mold foaming core[cite: 241]. It uses pre-polymerization particles that expand directly inside a closed mold to fill complex geometries that are impossible or too wasteful to produce via CNC machining[cite: 244, 245]. This process reduces manual work and material waste[cite: 246].

Rifeng H is our flagship high-temperature grade, capable of withstanding curing temperatures up to 180°C to 200°C and pressures up to 0.7 MPa[cite: 216]. It is engineered for primary structural aircraft components and launching rockets that require the highest compressive creep resistance during high-pressure autoclave cycles[cite: 214, 216].

Our Rifeng CR (coarse cell) and Rifeng FR (fine cell) grades are both self-extinguishing[cite: 147, 178]. They are optimized for the stringent fire safety requirements of high-speed rail vehicles and watercraft interiors, providing a flame-retardant structural core that maintains high mechanical strength[cite: 149, 180].