Rifeng H - High-Temperature Aerospace Grade PMI Foam for Demanding Curing Cycles

Premium High-Temperature PMI Structural Foam
Rifeng H is a closed-cell rigid foam based on Polymethacrylimide (PMI) polymer, completely free of CFC’s. It features a Coarse Cell Size, providing excellent machinability and superior surface adhesion. Its robust cell structure ensures maximum peel strength when combined with high-performance composite skins.

Rifeng H is specifically engineered for elite aeronautic and aerospace applications, including military and civil aircraft, satellite launching rockets, and heavy-duty UAVs. Its unmatched mechanical properties make it the standard material solution for primary structural aircraft components.

Superior Processing and Production Stability
Of all the Rifeng PMI foam grades, Rifeng H is best suited to withstand the most demanding process conditions. It maintains total dimensional stability during curing temperatures up to 180°C and pressures up to 0.7 MPa (dependent upon density).

It is the ideal core for advanced manufacturing techniques, including high-pressure autoclave processing, vacuum infusion (RTM, VARTM, VARI), and HP-RTM.

Weight Saving Efficiency
When building heavy-duty sandwich components, Rifeng H ensures that resin remains precisely at the interface. Its closed-cell structure eliminates internal resin migration, preventing undesirable "dead weight" and ensuring the highest strength-to-weight ratio for the finished parts.

Precision Thermoforming and Machining
Rifeng H is highly adaptable for complex geometries. It can be effortlessly CNC machined or thermoformed to meet stringent customer tolerances. We supply high-precision, pre-shaped cores ready for direct integration into aerospace assemblies.

Mechanical Properties (Typical Values)

Sales range for Rifeng H Grade

• Thickness tolerance ± 0.2 mm, length / width tolerance ± 2 mm.

Exceptional 180°C Thermal Stability
Rifeng H delivers the highest thermal resistance in our PMI foam range, making it the preferred choice for primary structural components in the aerospace and rocket industries.

Coarse Cell Size Adhesion for High-Load Parts
The Coarse Cell Size structure of Rifeng H provides unmatched mechanical interlocking with epoxy resins, ensuring superior peel strength and durability for helicopter blades and fuselage panels.

Engineered for High-Pressure Autoclave Cycles
As a leading PMI manufacturer, we produce H-series cores designed to withstand 0.7 MPa of pressure during high-temperature co-curing without structural collapse.

Product Advantages

• Maximum Heat Resistance: Stable at 180°C, perfect for aerospace prepreg systems.
• High Creep Resistance: Maintains dimensional accuracy under extreme pressure and heat.
• Superior Surface Bonding: Coarse Cell Size technology ensures high-integrity bond lines.